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Scaling Down Without Killing Yield: Minimum Trace Width, Spacing, and Microvia Size in HDI PCB Mass Production

Posted on September 7, 2026 by Freya Ólafsdóttir

High-density interconnect (HDI) PCBs are no longer limited to flagship smartphones and aerospace modules. They now appear in automotive radar, compact medical monitors, 5G infrastructure, and industrial vision systems. In every case, the design team must answer the same question: how small can the copper traces, clearances, and laser-drilled microvias become before mass production becomes…

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